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January 5, 2026

Powering the Innovation Behind the Scenes

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CES 2026 made one thing clear—Europe’s hardware vision is alive and accelerating. From AI-driven robotics and smart mobility to wearable health tech and next-gen computing, breakthrough products were everywhere.

What’s often overlooked is the critical foundation these ideas rely on. Every intelligent system on the CES floor, from the smallest device to the most advanced platform, depends on silicon to function. Behind the scenes of every breakthrough is a chip designed to handle complexity, speed, and scale.

That’s where we come in.

At Moores Lab AI, we support the builders shaping the future. While the spotlight is on what these machines can do, we’re focused on how to get there faster. The chips powering tomorrow’s innovation need to be developed with speed, confidence, and intelligence—and that’s exactly what our platform is built for.

As global momentum builds, we’re excited to keep supporting the engineers turning big ideas into powerful systems.

Check out the hardware renaissance in motion and imagine what’s possible when chip design moves just as fast.

Download the full white paper

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